The Termopasty B327 AGT-091 compound is used for etching printed circuit boards and removing copper. Alternatively, it can be used instead of ferric chloride. It dissolves easily without crystallizing in the solution, contributing to uniform etching and clearly defined outlines.
To use it, dissolve it in 0.5 liters of water at 50 °C, then etch at 40 °C, with a maximum temperature of 50 °C. Agitating the bath speeds up the process. The solution must not be stored in a hermetically sealed container, as this may cause excessive pressure and cracks.
- Use: Etching printed circuit boards and removing copper
- Solubility: Dissolves easily without crystallizing
- Amount of water for dissolving: 0.5 liters
- Dissolving temperature: 50 °C
- Etching temperature: 40 °C to 50 °C
- Solution storage: Do not store in a hermetically sealed container
- Type
- Cleaning Products & Accessories
Important information
Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.