Description
Specifications
Termopasty AG TermoGlue construction adhesive paste secures heat sinks and heat-generating components such as memory chips, transistors, and high-power LEDs. It creates a permanent bond with thermal conductivity above 1.0 W/mK. It is not intended for CPUs or GPUs, as it hardens and does not allow the heat sink to be removed.
Apply it to the contact point in a layer up to 6 mm thick. The surface dries in 2–8 minutes at 25 °C, while full curing takes 24–48 hours.
- Form: Paste
- Color: White
- Quantity: 10 ml
- Pieces: 1
- Packaging: Tube
- Use: Permanent thermally conductive bonding
- Thermal conductivity: Above 1.0 W/mK
- Operating temperature: 200 °C
- Maximum application thickness: 6 mm
- Surface drying time: 2–8 minutes at 25 °C
- Full curing time: 24–48 hours
- Hardness: 45–75
- Tensile strength: 2.0 MPa
- Elongation: 100%
- Volume resistivity: Below 2.0 × 10^15 c-in/W
- Dielectric strength: 20 kV/mm
- Dielectric loss factor (60 Hz): 0.003
Dimensions
- Form
- Paste
- Epoxy
- No
- 2-Component
- No
- Packaging Type
- Tube
- High Temperature
- No
- Colour
- White
- Pieces
- 1 pcs
Capacity
- Quantity
- 10 ml
Important information
Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.