- Cleans and prevents metal oxidation and allows soldering to create strong, long-lasting mechanical and electrical bonds.
- Also acts as a wetting agent, increasing solder flow and the efficiency of the soldering process.
- Ideal for mobile phones, PC cards, and other advanced electronic chip flow soldering.
- Cleans and prevents metal oxidation and allows soldering to create strong, long-lasting mechanical and electrical bonds.
- Also acts as a wetting agent, increasing solder flow and the efficiency of the soldering process.
- Ideal for mobile phones, PC cards, and other advanced electronic chip flow soldering.
Specifications
- M.P: 183°C
- Alloy: Sn63/Pb37
- volume: 10cc
Product Details
- Type
- Paste
Quantity
- Capacity
- 10 ml
Important information
Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.