AG GOLD is a high-performance thermal paste. The gold content of up to 45% offers exceptional thermal conductivity, three times that of regular paste. This product can reduce CPU temperature by up to 6 degrees without the need to change the heatsink. It is ideal for users involved in overclocking.
- Color: gold
- Thermal Conductivity: > 2.8 W / mK
- Thermal Resistance: 2.5 g / cm3
- Evaporation: 5.1
- Non-liquid viscosity
- Thixotropic index: 380 +/- 10
- Temperature carrier: -50 ~ 340 °C
- Operating Temperature: -30 ~ 300 °C
- Quantity
- 1 gr
- Usage
- CPU/GPU
Important information
Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.