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High thermal conductivity
TG-30 is a premium thermal paste that provides a high level of cooling performance, designed to effectively reduce CPU temperatures. The thermal compound contains diamond powder, which guarantees thermal conductivity of 4.5 W/m-k, covering the basic needs of most users.
Easy to apply
The specially formulated thermal paste by Thermaltake fits perfectly into the honeycomb stencil, providing an easier way to apply thermal paste to a neat and well-coated surface that suits all CPUs. The high-quality thermal paste ensures longer lifespan by eliminating drying or cracking during use. The non-conductive compound provides better safety measures for you and your system.
Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.