Low Melt hot melt glue 11mm 20pcs. by Steinel

Suitable for materials sensitive to temperature changes.

Characteristics:

• Low melting point for temperature-sensitive materials such as polyurethane foam and polystyrene foam.
• Processing temperature only 130°C, providing substrate protection.
• Material solidifies after 80 seconds.
• Bears load approximately 40 seconds after application.
• Diameter: 11 mm.
• Color: Transparent.
• Length: 300 mm.
• Number of pieces: 20 pcs.
• Weight: 0.6 kg.
• Usage: Universal.