The Gelid Solutions GP-Ultimate thermal pad transfers heat in applications that require a flexible material with high thermal conductivity. Its multilayer structure conforms to irregular shapes and components of varying heights, and it can be cut to the desired size.
It is used, among other applications, between water blocks and RAM, on power delivery components, high-temperature SMD components, motherboard bridges, hard drives, and densely packed components on graphics card PCBs. Before use, remove the protective film from both sides.
- Type: Thermal pad
- Thermal conductivity: 15 W/mK
- Dimensions: 120 x 120 x 1.5 mm
- Quantity: 2
- Density: 3.2 g/cm³
- Electrical conductivity: Not electrically conductive
- Corrosion: Non-corrosive
- Curing: Does not harden
- Toxicity: Non-toxic
Main Specifications
- Type
- Thermal Pad
- Colour
- -
Thermal Pad Dimension
- Length
- 120 mm
- Width
- 20 mm
- Thickness
- 1.5 mm
Important information
Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.