The GP-Ultimate is designed to provide a perfect thermal interface for heat transfer to heatsinks when installed on PCBs with height differences and uneven surfaces such as IC DRAM, IC VRM, power MOSFET, NVRAM IC, and other high-temperature SMD components.

Thanks to the improved multilayer mesh, superior material composition, and ultimate thermal conductivity of 15 W/mK, the GP-Ultimate offers the best performance in its class.