The Gelid GP-Extreme Thermalpad is a thermally conductive pad used where it is necessary to incorporate a flexible material with high thermal conductivity, e.g., in connections such as RAM water blocks, power supply sections, SMD components, etc.

Thanks to its soft structure, it is ideal for cooling irregularly shaped components and components located at various heights. It allows covering joints from microscopic scratches to visible irregular surfaces.

Due to its excellent thermal conductivity, it can be used even for components with a large surface area, such as bridges on the motherboard, hard drives, and densely packed components on the PCB.

• High thermal conductivity: 12W/mK - top in its category.
• Ease of application: Does not conduct electricity.
• Enduring quality: Does not cause corrosion, does not harden and is non-toxic.
• Hardness (Shore): 35 OO

Product features:

• Color: Gray
• Thermal conductivity: 12 W/m-K
• Density: 2.8 g/cm3
• Dimensions: 120x20 mm
• Thickness: 3 mm
• Operating temperature: From -55°C to 200°C
• Commodity class: S
• Number of thermal adjectives: 1