The Gelid Solutions GP-Ultimate thermal pad transfers heat to heatsinks and PCB boards with height differences or uneven surfaces. Its multilayer matrix has a thermal conductivity of 15 W/mK. It is electrically non-conductive, non-corrosive and does not harden.
Suitable for DRAM ICs, VRM ICs, power MOSFETs, NVRAM ICs and other hot SMD components, as well as RAM modules, GPU and CPU VRM circuits, and M.2 SSDs.
- Type: Thermal pad
- Colour: Blue
- Length: 120 mm
- Width: 20 mm
- Thickness: 3 mm
- Thermal conductivity: 15 W/mK
- Operating temperature: -60 °C to 220 °C
- Electrical conductivity: Electrically non-conductive
- Properties: Non-corrosive and does not harden
Main Specifications
- Type
- Thermal Pad
- Colour
- Blue
Thermal Pad Dimension
- Length
- 120 mm
- Width
- 20 mm
- Thickness
- 3 mm
Important information
Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.