The Gelid Solutions TP-GP04-R-B thermal pad transfers heat away from computer components and conforms to surfaces with varying heights or irregular shapes. Its multilayer structure helps fill gaps ranging from small scratches to noticeable uneven areas, and it can be cut to the desired size.
It is used, among other applications, on RAM water-block connections, power supply sections, high-temperature SMD components, motherboard bridges, hard drives, and graphics card board components. It is electrically non-conductive, does not corrode or harden, and is non-toxic. Before use, remove the protective films from both sides. Compression greater than half its nominal thickness is not recommended.
- Type: Thermal pad
- Thermal conductivity: 15 W/mK
- Thickness: 1 mm
- Width: 120 mm
- Length: 120 mm
- Density: 3.2 g/cm³
- Shore hardness: 60–70 °C
- Operating temperature: -60 °C to 220 °C
- Electrical conductivity: Non-conductive
Main Specifications
- Type
- Thermal Pad
Thermal Pad Dimension
- Length
- 120 mm
- Width
- 120 mm
- Thickness
- 1 mm
Important information
Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.