The advanced multilayer structure allows perfect application on surfaces with irregularities, effectively bridging the gap between heated components and your heatsink.

It is ideal for applications such as:

• Connecting water blocks with RAM modules.
• Cooling power supply sections (VRM).
• SMD components that generate high temperatures.

With dimensions of 90x50mm and a thickness of 0.5mm, this pad provides the necessary flexibility for easy installation, protecting sensitive electronic parts from overheating. The material's reliability ensures consistent performance even under demanding operating conditions.