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Flexible thermally conductive pad Gelid GP-Extreme suitable for applications requiring high thermal conductivity material, such as connecting a water block to RAM modules, power supply components, and SMD elements. Its soft structure adapts to irregularly shaped or differently high components, filling gaps from tiny cracks to noticeable irregularities. It is also suitable for large surface components, such as motherboard bridges, hard drives, and densely packed PCB elements.
It is noted that thermal pad usage is not recommended when it has been compressed beyond half of its nominal thickness.
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