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The flexible thermally conductive pad Gelid GP-Extreme is suitable for applications requiring high thermal conductivity material, such as connecting water blocks with RAM modules, power supply components, and SMD elements. Its soft structure adapts to irregularly shaped or height-different components, filling gaps from tiny crevices to noticeable bumps. It is also suitable for large surface components, such as motherboard bridges, hard drives, and densely placed PCB components.
Using the thermal pad is not recommended when it has been compressed more than half of its nominal thickness.
Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.