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Thermal conductive pad for applications requiring flexible material with high thermal conductivity, suitable for:
Its soft structure makes it ideal for cooling irregularly shaped or height-different components, as well as filling gaps from microscopic scratches to noticeable surface irregularities. It can also be used on large surface elements such as motherboard bridges, hard drives, and densely packed components on PCBs. It can be cut to desired dimensions. Remove the protective film from both sides before use.
Thermal conductivity: 12W/mK
Specifications:
It is not recommended to compress the thermal pad more than half of its nominal thickness.
Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.