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The flexible thermally conductive pad Gelid GP-Extreme is suitable for applications where a high thermal conductivity material is required, such as connecting a water block to RAM modules, power supply components, and SMD elements. Its soft structure conforms to irregularly shaped or differently elevated components and fills gaps from tiny crevices to noticeable imperfections. The pad can be cut to desired dimensions. Before use, remove the protective film from both sides.
It is not recommended to use the thermal pad when it has been compressed more than half of its nominal thickness.
Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.