Thermal pad for applications where flexible material with high thermal conductivity is required, such as connecting a water block with RAM memory, power supply sections, and SMD components. The soft structure is suitable for irregularly shaped components or components at different heights. It can cover connections from microscopic cracks to visible irregular surfaces and can be cut to the desired dimensions. Before use, remove the protective film from both sides.

• Thermal conductivity: 12W/mK
• Dimensions: 80x40x2mm
• Density: 2.8g/cm3
• Hardness (Shore): 35 OO
• Does not conduct electricity.
• Does not cause corrosion, does not harden, and is non-toxic.
• Use of the thermal pad is not recommended if compressed more than half of its nominal thickness.