The Gelid GP-Extreme thermal pad is a thermal pad used where a flexible material with high thermal conductivity is required, such as connections between water blocks, RAM, power supplies, and SMD components. Its soft structure makes it ideal for cooling irregularly shaped components and components mounted at different heights, allowing the filling of connections from microscopic scratches to visible uneven surfaces.

Due to its excellent thermal conductivity, the pads can even be used on large surface components, such as motherboard bridges, hard drives, and densely packed PCB components.

• High thermal conductivity: 12 W/mK - top in its class.
• Easy application.
• Non-conductive electrically.
• Non-corrosive, non-hardening, non-toxic.
• Shore hardness: 35 OO.

Product specifications:

• Thermal conductivity: 12 W/m-K.
• Density: 2.8 g/cm³.
• Dimensions: 120x20 mm.
• Thickness: 1 mm.
• Manufacturer: Gelid.