The Gelid Solutions thermal pad is a flexible, thermally conductive material for use with water blocks, RAM, power delivery components, and SMD components. Its soft structure conforms to irregularly shaped components or components of varying heights, filling gaps ranging from microscopic grooves to visible unevenness. It can be cut to the desired dimensions.
- Color: Gray
- Thickness: 2.5 mm
- Width: 40 mm
- Length: 80 mm
- Thermal conductivity: 12 W/mK
- Density: 2.8 g/cm³
- Hardness (Shore): 35 OO
- Electrical conductivity: Non-conductive
- Properties: Non-corrosive, does not harden, and is non-toxic
- Preparation before use: Remove the protective film from both sides
- Compression limit: Compression beyond half the nominal thickness is not recommended
Main Specifications
- Type
- Thermal Pad
- Colour
- Grey
Thermal Pad Dimension
- Length
- 80 mm
- Width
- 40 mm
- Thickness
- 2.5 mm
Important information
Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.