Elastic thermal conductive pad suitable for applications requiring high thermal conductivity material, such as water blocks, RAM memories, power supply sections, and SMD components. The soft structure adapts to irregularly shaped or different height components and fills gaps from microscopic scratches to visible irregularities. It can be cut to desired dimensions. Before use, the protective film must be removed from both sides.

• Thermal conductivity: 12W/mK
• Density: 2.8g/cm³
• Hardness (Shore): 35 OO
• Does not conduct electricity
• Does not cause corrosion, does not harden, and is non-toxic
• Use of the thermal pad is not recommended when compressed more than half of its nominal thickness