The Gelid Solutions thermal pad transfers heat in applications such as RAM water blocks, power components, and SMD components. Its soft structure conforms to irregularly shaped or uneven surfaces and fills gaps ranging from microscopic scratches to noticeable irregularities.
It can be used on large-surface components, such as motherboard bridges, hard drives, and densely packed PCB components. It can be cut to the desired dimensions. Before use, remove the protective film from both sides. Compression of more than half the nominal thickness is not recommended.
- Type: Thermal pad
- Color: Grey
- Thickness: 2.5 mm
- Length: 120 mm
- Thermal conductivity: 12 W/mK
- Density: 2.8 g/cm³
- Hardness: 35 OO (Shore)
- Electrical conductivity: Non-conductive
- Properties: Non-corrosive, does not harden, and is non-toxic
Main Specifications
- Type
- Thermal Pad
- Colour
- Grey
Thermal Pad Dimension
- Length
- 120 mm
- Width
- -
- Thickness
- 2.5 mm
Important information
Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.