Thermal conductivity paste Qoltec 51637 Grey 5g in syringe, suitable for precise filling of micro-voids between the processor and cooling system.
- Thermal conductivity: 1.93 W/mK
- Thermal resistance:
- Operating temperature: -30 °C ~ 300 °C
- Particle size: 5 µm
- Specific weight: 2.3 g/cm³
- Net weight: 5 g
- Compliance certifications: CE
- Quantity
- 5 gr
- Usage
- CPU/GPU
Important information
Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.