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Miscellaneous Cooling
Thermally conductive pad suitable for applications requiring flexible material with very high thermal conductivity. Ideal for connecting water blocks with RAM memory, power supply components, high-temperature SMD elements, motherboard bridges, hard drives, and densely packed components on graphics card PCBs.
The multilayer structure adapts to irregular shapes and components of different heights. It can be cut to desired dimensions. Before use, it is necessary to remove the protective membrane from both sides. The pad is non-electrically conductive, does not cause corrosion, does not harden, and is non-toxic.
Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.