Material: Made from acid-free, semi-solid flux that does not spill easily, with moderate acidity, lead-free, and non-corrosive.

Benefits: Electronic enthusiasts and mechanical workers often face electronic soldering. This soldering paste is easy to transport and easy to use. It is easy to solder with this paste, as well as to clean up.

Usage: Wipe the surface of the item before soldering. Use this paste on soldered copper, tin, iron, and other metals, and then solder the tin to the solder joint.

Application: The boiling temperature is slightly higher than the soldering temperature. It meets general instrument requirements, soldering onto copper, tin, iron, and other metals, soldering components, BGA, mobile phone chip soldering, LED lighting, device repair, etc.

Note: This product is clean but is also slightly conductive. After cleaning the board, ensure it has been wiped well before applying electrical power to avoid short circuits.