Soldering Paste & Flux

Rosfix KZ7U-HAXC Soldering Paste 35gr

Rosfix Paste Lutownicza (liquid solder wax) XG-50 35g

  • No cleaning required: No rinsing needed after the lutoation process, increasing process efficiency.
  • Silver formula: New formula with silver for...

Rosfix Paste Lutownicza (liquid solder wax) XG-50 35g

  • No cleaning required: No rinsing needed after the lutoation process, increasing process efficiency.
  • Silver formula: New formula with silver for exceptional lutoation effectiveness.
  • Used in GSM and BGA: Ideal for GSM technology and BGA bases, ensuring desired field reproduction during BGA circuit...
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Description

Description

Rosfix Paste Lutownicza (liquid solder wax) XG-50 35g

  • No cleaning required: No rinsing needed after the lutoation process, increasing process efficiency.
  • Silver formula: New formula with silver for exceptional lutoation effectiveness.
  • Used in GSM and BGA: Ideal for GSM technology and BGA bases, ensuring desired field reproduction during BGA circuit lutoation.
  • Preliminary BGA pad coverage with lead: Suitable for preliminary leaded BGA pad lutoation.
  • Easy application and activation: Simple to apply, activated by heating to 183°C.
  • No cleaning needed after lutoating: No rinsing required once the process is completed.
  • Store at 0°C - 10°C: Maintains properties with proper storage.
  • Resin- and solvent-based flux: Contains resin- and solvent-based flux for effective lutoation.

Technical specifications:

  • Melting temperature: 183°C
  • Weight: 35g
  • Composition: Sn63 / Pb37
  • Particle size: 25-38 µm
  • Viscosity: 50 (Pa·S)

Manufacturer

See full description

Specifications

Specifications

Product Details

Type
Paste

Quantity

Weight
35 gr

Important information

Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.

See all specifications

Description & Specifications

Rosfix Paste Lutownicza (liquid solder wax) XG-50 35g

  • No cleaning required: No rinsing needed after the lutoation process, increasing process efficiency.
  • Silver formula: New formula with silver for exceptional lutoation effectiveness.
  • Used in GSM and BGA: Ideal for GSM technology and BGA bases, ensuring desired field reproduction during BGA circuit lutoation.
  • Preliminary BGA pad coverage with lead: Suitable for preliminary leaded BGA pad lutoation.
  • Easy application and activation: Simple to apply, activated by heating to 183°C.
  • No cleaning needed after lutoating: No rinsing required once the process is completed.
  • Store at 0°C - 10°C: Maintains properties with proper storage.
  • Resin- and solvent-based flux: Contains resin- and solvent-based flux for effective lutoation.

Technical specifications:

  • Melting temperature: 183°C
  • Weight: 35g
  • Composition: Sn63 / Pb37
  • Particle size: 25-38 µm
  • Viscosity: 50 (Pa·S)

Manufacturer

Product Details

Type
Paste

Quantity

Weight
35 gr

Important information

Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.