Mobile Phone Repair Tools

Kaisi Tool Set for Phone Repair 128740

KAISI BGA/IC solder paste kit KAI-338

Features:

  • Melting point: 217 °C
  • Volume: Solder paste: 25g, Solder oil: 5cc

Package contents:

  • Solder oil
  • Solder paste

Category: Solder paste

KAISI BGA/IC solder paste kit KAI-338

Features:

  • Melting point: 217 °C
  • Volume: Solder paste: 25g, Solder oil: 5cc

Package contents:

  • Solder oil
  • Solder paste

Category: Solder paste

See full description See full description

Description

Description

KAISI BGA/IC solder paste kit KAI-338

Features:

  • Melting point: 217 °C
  • Volume: Solder paste: 25g, Solder oil: 5cc

Package contents:

  • Solder oil
  • Solder paste

Category: Solder paste

Manufacturer

See full description

Specifications

Specifications

Type
Tool Set

Important information

Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.

See all specifications

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Description & Specifications

KAISI BGA/IC solder paste kit KAI-338

Features:

  • Melting point: 217 °C
  • Volume: Solder paste: 25g, Solder oil: 5cc

Package contents:

  • Solder oil
  • Solder paste

Category: Solder paste

Manufacturer

Type
Tool Set

Important information

Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.

Reviews (1)

  1. 1
  2. 4 stars
    0
  3. 3 stars
    0
  4. 2 stars
    0
  5. 1 star
    0
Review this product
7,74 €
14,00 €   shipping cost