CPU Processors

AMD Epyc 7303 2.4GHz Processor 16 Core for Socket SP3 Tray

Key features:

  • Zen 3 Microarchitecture
  • Threads: 32
  • Max Frequency: 3.4 GHz
  • Cache Memory: 64 MB
  • Locked
  • Thermal Design Power (TDP) 150 W
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Description

Description

The AMD Epyc 7303 processor is based on the Zen 3 microarchitecture (2023). It features 16 cores with 32 threads. More cores provide increased power for programs that take advantage of a larger number of cores. Threads allow the processor to run multiple applications simultaneously, completing tasks faster. Its maximum frequency is 3.4 GHz.

It incorporates 64 MB of Cache memory. Cache memory is a very important feature as the larger it is, the less time the processor needs to retrieve data from the computer's main memory, significantly boosting performance.

It features the SP3 Socket and will need to be housed in a motherboard with a corresponding Socket. Finally, a heatsink is not included. You will need to purchase a separate heatsink for the processor, which is essential.

The Epyc 7303 is chosen for professional Server systems and workstations where high processing power is required in areas such as artificial intelligence and high-performance computing (HPC), thanks to its large memory bandwidth and excellent I/O.

The "Zen 3" microarchitecture processors are designed for gaming, offering up to 19% greater performance compared to older generations, combined with up to 24% lower energy consumption. They feature greater bandwidth contributing to increased performance. The large Cache memory, double that of "Zen 2," promises minimal delays in core-to-core communication, something that gamers will fully exploit. Indicatively, gamers in 1080p games will experience an average performance increase of 26%.

Manufacturer

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Specifications

Specifications

Main Specifications

Year of Release
2023
Family
Epyc
Microarchitecture
Zen 3
Socket
SP3
Packaging
Tray
Compatible Chipset
-
Type
Server

Performance

Cores
16
Threads
32
Processor Frequency (Base Frequency)
2.4 GHz
Max Processor Frequency
3.4 GHz
Cache memory
64 MB
Unlocked
No
Thermal Design Power (TDP)
150 W

Features & Functions

Includes Heatsink
No

Important information

Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.

See all specifications

Description & Specifications

The AMD Epyc 7303 processor is based on the Zen 3 microarchitecture (2023). It features 16 cores with 32 threads. More cores provide increased power for programs that take advantage of a larger number of cores. Threads allow the processor to run multiple applications simultaneously, completing tasks faster. Its maximum frequency is 3.4 GHz.

It incorporates 64 MB of Cache memory. Cache memory is a very important feature as the larger it is, the less time the processor needs to retrieve data from the computer's main memory, significantly boosting performance.

It features the SP3 Socket and will need to be housed in a motherboard with a corresponding Socket. Finally, a heatsink is not included. You will need to purchase a separate heatsink for the processor, which is essential.

The Epyc 7303 is chosen for professional Server systems and workstations where high processing power is required in areas such as artificial intelligence and high-performance computing (HPC), thanks to its large memory bandwidth and excellent I/O.

The "Zen 3" microarchitecture processors are designed for gaming, offering up to 19% greater performance compared to older generations, combined with up to 24% lower energy consumption. They feature greater bandwidth contributing to increased performance. The large Cache memory, double that of "Zen 2," promises minimal delays in core-to-core communication, something that gamers will fully exploit. Indicatively, gamers in 1080p games will experience an average performance increase of 26%.

Manufacturer

Main Specifications

Year of Release
2023
Family
Epyc
Microarchitecture
Zen 3
Socket
SP3
Packaging
Tray
Compatible Chipset
-
Type
Server

Performance

Cores
16
Threads
32
Processor Frequency (Base Frequency)
2.4 GHz
Max Processor Frequency
3.4 GHz
Cache memory
64 MB
Unlocked
No
Thermal Design Power (TDP)
150 W

Features & Functions

Includes Heatsink
No

Important information

Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.

891,75 €
14,00 €   shipping cost