Liquid Paste (Liquid Electronic Glue) in Syringe XG-Z40 35g No Clean

• No rinsing necessary: No need to wash after the process, increasing efficiency.
• Silver formulation: New formula containing silver for exceptional fluxing effectiveness.
• Suitable for GSM and BGAP: Ideal for GSM and BGAP technologies, ensuring desired flux field reproduction in BGA.
• Pre-assembly BGA Paste with Lead Solder: Excellent for pre-assembling BGA joints with lead solder.
• Easy application and activation: Easy to apply, activated by heating to 183°C. After applying the paste, heat with hot air, infrared, or conventional heating.
• Storage at 0°C - 10°C: Maintains properties with proper storage.
• Resin- and solvent-based flow: Contains resin-based and solvent-based formulation for effective fluxing.

Technical Characteristics:

• Melting temperature: 183°C
• Weight: 42g
• Composition: Sn63 / Pb37
• Particle size: 25-38 µm
• Viscosity: 50 (Pa·S)