An effective thermal paste characterized by high thermal conductivity and high insulation. It perfectly fills the connections and micro-gaps between the processor and the cooling system base. The paste spreads very easily and can be used for a long time without the need for replacement.

• Weight: 30 g.
• Thermal conductivity: 5.15 W/mK
• Operating temperature: from -30°C to 280°C
• Type: Thermal paste
• Density: 3.25 g/cm3
• Color: Gray