Soft soldering paste 100 g
Quantity: 100 g
Produced based on the flow according to DIN EN 29454, fine powder obtained from binders according to DIN EN 29453 and a binding medium. During soldering, soft soldering should also be used.
- Easy removal of solvent residues in cold water by rinsing according to KIN 1988
- No detachment of the paste
- High performance due to solder content
- Operating temperature 227°C-310°C
- Quantity
- 100 gr
- Usage
- CPU/GPU
Important information
Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.