Very soft, silicone-based with a special filler material, the TP-3 surpasses high-performance pads, especially when height differences of closely placed chips usually appear due to manufacturing tolerances. The TP-3 offers excellent thermal conductivity despite its extremely low hardness.

Thermally conductive, vibration damping, formable, electrically insulating - safe and easy to use. Thanks to its good compression properties, the soft thermal conductivity pad is especially gentle on components while also being a good conductor of heat. In addition to the standard form for M.2, the TP-3 is available in various sizes and thicknesses, which can be easily cut to the desired shape and size.

The TP-3 is softer than conventional pads and therefore particularly suitable for different chip heights. Thanks to their good compressibility properties, the thermal pads act as the perfect gap filler material and bridge uneven surface and air gaps without stressing sensitive and protruding components.