Solder filler on 100g spools.
Composition:
- Tin: approximately 60%
- Lead: approximately 40%
Melting point: 183 to 190°C.
The soldering filler is mainly used in the electronics industry, for the production of standard electronic devices and components, in electrotechnics, and for the soldering of components with coatings of tin, tin-lead, cadmium, zinc, and silver.
Diameter: 3mm.
- Type
- Miscellaneous Consumables
- Weight
- 100 gr
Important information
Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.