Filler metal solder 1.5mm on a 100g spool.

Features:

• Tin content: approximately 60%
• Lead content: approximately 40%
• Melting point: 183 to 190°C
• Diameter: 1.5mm
• Packaged in blister

The solder filler is mainly used in the electronics industry, for the production of standard electronic devices and components, electrotechnics, and for soldering components with tin, tin-lead, cadmium, zinc, and silver coatings.