Thermal paste Halnziye HY510 1.93 W/m-k Gray 30g Syringe

Silicone heat sink compound for CPU processors. Thermal paste for application on electronic components. It helps in heat dissipation and maintaining the maximum performance of your computer components, such as processors, CPU, graphics cards, GPU, chipsets, computers, consoles, avoiding overheating and temperature issues.

• Non-toxic and non-corrosive product
• High conductivity
• Stable performance at high temperatures

Composition: Silicone compound (50%), carbon compound (30%), metal oxide compound (20%).

Thermal conductivity: >1.93 W/m-k.