Thermally conductive pad for applications requiring a flexible material with very high thermal conductivity, such as connecting water blocks to RAM modules, power supply components, high-temperature SMD components, motherboard bridges, hard drives, and densely packed components on graphics card PCBs.

The multilayer structure adapts to irregular shapes and components of different heights, filling gaps from small scratches to noticeable irregularities. It can be cut to the desired dimensions. Before use, remove the protective film from both sides.

• Thermal conductivity: 15W/mK
• Dimensions: 90x50x3.0mm
• Density: 3.2g/cm3
• Not electrically conductive.
• Does not cause corrosion, does not harden, and is non-toxic.
• Easy to apply with high-quality components.