The Gelid GP-Ultimate thermal pad is designed for cooling applications that require a flexible material with high thermal conductivity, such as RAM modules, power delivery components, motherboard bridges, hard drives, and densely packed components on graphics cards. Its multilayer construction conforms to irregular shapes and components of different heights, filling gaps ranging from small grooves to noticeable unevenness.
It can be cut to the desired dimensions. Before use, remove the protective film from both sides.
- Type: Thermal pad
- Dimensions: 90 × 50 × 3 mm
- Quantity: 2 pieces
- Thermal conductivity: 15 W/mK
- Density: 3.2 g/cm³
- Electrical conductivity: Not electrically conductive
- Properties: Non-corrosive, does not harden, and is non-toxic
- Colour
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Important information
Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.