The Gelid GP-Ultimate thermal pad is designed for cooling components such as RAM modules, power delivery components, and hot SMD components. Its flexible, multilayer structure adapts to irregularly shaped components or components of varying heights, filling gaps ranging from small scratches to larger uneven areas. It can be cut to the desired dimensions. Before use, remove the protective films from both sides.
It can also be used on large-surface components, such as motherboard bridges, hard drives, and densely packed components on graphics card PCBs. It is electrically non-conductive, non-corrosive, does not harden, and is non-toxic.
- Dimensions: 90 × 50 × 2 mm
- Pieces: 2
- Thermal conductivity: 15 W/mK
- Density: 3.2 g/cm³
- Colour
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Important information
Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.