Description
Specifications
Rosfix Flux Paste in Syringe NC-559-ASM
- No-clean – Does not require cleaning after soldering
- Thick consistency – Easy application and precise placement
- Easy cleaning – Removed with isopropanol
- Ideal for reballing/BGA/SMD – Excellent for advanced soldering techniques
- High activity – Effective surface moisture removal
Rosfix Solder Paste (Full Sole) XG-50 35g
- Melting temperature: 183°C
- Solder alloy: Sn63 / Pb37
- Particle size: 25-38 µm
- Viscosity: 50 (Pa·S)
Product Details
- Type
- Liquid
Quantity
- Weight
- 35 gr
Important information
Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.