The Kolink Umbra Pro TP1 thermal paste is designed to dissipate heat from processors and graphics cards. Its formula allows for easy application.
- Use: For CPU/GPU
- Quantity: 1.5 g
- Thermal conductivity: 12.8 W/mK
- Temperature range: −50 °C to 250 °C
- Density: 2.9 g/cm³
- Quantity
- 1.5 gr
- Usage
- CPU/GPU
Important information
Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.