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Thermally conductive pad for applications where flexible material with high thermal conductivity is required, such as connections with water blocks for RAM memory, power supply sections, and SMD components. Its soft structure is suitable for cooling irregularly shaped or varying height components and for filling gaps from microscopic scratches to visible surface irregularities. It can also be used on large surface components, such as motherboard bridges, hard drives, and densely placed components on PCBs. It can be cut to the desired dimensions. Remove the protective film from both sides before use.
Specifications:
It is not recommended to compress the thermal pad more than half of its nominal thickness.
Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.