The Gelid Solutions thermal pad transfers heat in cooling applications, such as RAM water blocks, power supply components, and SMD components. Its soft structure conforms to irregularly shaped or different-height components and fills gaps and surface imperfections. It can also be used on large-surface components, such as motherboard bridges, hard drives, and densely packed PCB components.
Cut it to the desired size. Before use, remove the protective film from both sides. Compressing it to less than half its nominal thickness is not recommended.
- Type: Thermal Pad
- Color: Gray
- Thickness: 0.5 mm
- Length: 120 mm
- Thermal conductivity: 12 W/mK
- Density: 2.8 g/cm³
- Hardness (Shore): 35 OO
- Electrical conductivity: Non-electrically conductive
- Other features: Non-corrosive, does not harden, and is non-toxic
Main Specifications
- Type
- Thermal Pad
- Colour
- Grey
Thermal Pad Dimension
- Length
- 120 mm
- Width
- -
- Thickness
- 0.5 mm
Important information
Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.