AI-based PCB technology uses AI algorithms to optimize vias, routing, and stackups. It ensures top performance and signal integrity in both single and cross-layer throughout the design process.
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AI-ViaFusion Technology
Optimized vias & pads for signal integrity
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AI-Trace Technology
Smart routing for maximum performance
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AI-Layer Technology
Customized stacks for enhanced functionality
Key Features:
AI-generated design recipes
Artificial intelligence simulation
Signal verification powered by artificial intelligence
Single and multi-layer signal optimization
AI-ViaFusion™ Technology - AI-Powered Excellence in Signal Integrity
Signal reflection reduction Up to 28.2%
AI-ViaFusion, an AI-assisted via optimization technology, determines optimal via and pad sizes across PCB areas. This technology enhances multi-layer signal integrity and transmission performance, surpassing traditional design methods.
Best-in-class signal quality
- Superior signal transmission performance
- Significantly reduced signal reflection
- Increased signal quality and reliability
- Improved multi-layer PCB signal performance
AI-ViaFusion Technology - AI-Engineered Via Design Formula
AI-ViaFusion is a proprietary AI-generated hybrid via structure design. This PCB technology, validated through AI simulations and testing, aims to improve high-speed signal transmission.
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Optimized via design
Varies according to sizes for optimized signal and power paths
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Pad-Driven Optimization
Customized pad sizes for performance and production balance
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Precision complex impedance matching
Selected via & pad sizes for optimal signal impedance
Unlock AI-supported performance with AI-ViaFusion technology
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Minimized insertion loss
Optimized vias reduce signal loss
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Enhanced return loss
Precision complex impedance matching reduces reflections
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Optimized eye diagram
The wider eye opening enhances signal integrity
* Eye Diagram: A signal quality evaluation tool in digital communications. It overlays bit cycle waveforms into a pattern resembling an eye. A larger, cleaner opening indicates better signal quality and transmission reliability.
AI-ViaFusion Technology - AI-Driven Revolution in PCB Design
Vias (Vertical Interconnect Access) are critical for multi-layer PCB connectivity. Via size significantly impacts signal integrity, affecting capacitance, reflections, and crosstalk.
AI-ViaFusion technology optimizes PCB performance through:
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Strategic Via Sizing
Optimized for diverse signals across the PCB
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Enhanced impedance matching
Precise control via machine learning
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Space optimization
Maximized layout efficiency with signal integrity
AI-Trace Technology - Revolutionary AI PCB Routing
AI-Trace technology transforms PCB design by leveraging artificial intelligence to optimize trace routing, resulting in improved performance and signal integrity.
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Mitigation of fiber weave effect
Optimized signal timing
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Shielded memory routing
Optimized signal shielding and accuracy
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Optimized impedance topology
Refined traces with minimal resistance
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Isolated memory routing
Optimized trace layout and layer separation
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Daisy-Chained Routing
Innovative design eliminates signal congestion points
Enjoy next-generation PCB routing with GIGABYTE's AI-Trace technology.
Mitigating Fiber Weave Impact with AI-Trace Technology
The fiber weave effect in high-speed PCBs arises from varying dielectric constants of epoxy resin and glass fibers, causing diverse signal propagation speeds, leading to signal integrity issues such as coupling and jitter. AI-Trace technology applies innovative routing angles to mitigate this effect.
Benefits of mitigation:
- Reduces signal distortion
- Improves transmission reliability
- Supports higher data rates
- Enhances overall system stability
AI-Layer Technology - Next-Generation Multi-Layer PCB Design
AI-Layer technology creates innovative layer materials for multi-layer PCBs, delivering unparalleled performance.
Core innovation:
AI-optimized customized layer design
- AI-optimized layer design
- Unique material for each layer
- AI-verified signal integrity
- Customized PCB for maximum performance
Key Features:
- PCB layer optimized with artificial intelligence and design material Enhanced 2X copper technology
- Server-grade low-loss PCB
(* Low loss only for the 8-layer PCB model)
