Mobile Phone Repair Tools

Jly Motherboard Repair Stand Bst-1023aplus Iphone Bga Stencils

The JLY BST-1023APLUS motherboard repair base for iPhone is an excellent tool for repairs. It features a double-sided design for greater compatibility and strong magnetic absorption for easy placement...

The JLY BST-1023APLUS motherboard repair base for iPhone is an excellent tool for repairs. It features a double-sided design for greater compatibility and strong magnetic absorption for easy placement of BGA reballing stencils. It is compatible with the iPhone models 12, 12 Pro, 12 Pro Max, IPX, XS, XS Max, 11, 11 Pro, and 11 Pro Max.

  • Strong magnetic...
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Description

Description

The JLY BST-1023APLUS motherboard repair base for iPhone is an excellent tool for repairs. It features a double-sided design for greater compatibility and strong magnetic absorption for easy placement of BGA reballing stencils. It is compatible with the iPhone models 12, 12 Pro, 12 Pro Max, IPX, XS, XS Max, 11, 11 Pro, and 11 Pro Max.

  • Strong magnetic absorption capability
  • Double-sided design for compatibility with more smartphones
  • Precise placement of the motherboard

Package contents:

  • Motherboard holder fixture
  • 8x BGA reballing stencils

Material: Aluminum alloy + strong magnet + high quality steel

Base size: 121 x 71 x 10mm

Steel mesh size: 112 x 62 x 0.1mm

Weight: 170g

Manufacturer

OEM
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Specifications

Specifications

Type
Repairing Pads

Important information

Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.

See all specifications

Description & Specifications

The JLY BST-1023APLUS motherboard repair base for iPhone is an excellent tool for repairs. It features a double-sided design for greater compatibility and strong magnetic absorption for easy placement of BGA reballing stencils. It is compatible with the iPhone models 12, 12 Pro, 12 Pro Max, IPX, XS, XS Max, 11, 11 Pro, and 11 Pro Max.

  • Strong magnetic absorption capability
  • Double-sided design for compatibility with more smartphones
  • Precise placement of the motherboard

Package contents:

  • Motherboard holder fixture
  • 8x BGA reballing stencils

Material: Aluminum alloy + strong magnet + high quality steel

Base size: 121 x 71 x 10mm

Steel mesh size: 112 x 62 x 0.1mm

Weight: 170g

Manufacturer

OEM
Type
Repairing Pads

Important information

Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.

46,00 €
14,00 €   shipping cost