Genesis NTG-2329 thermal paste is used on CPUs and GPUs to transfer heat. It has a thermal conductivity of 12.8 W/(m·K) and a density of 2.8 g/cm³, and is non-conductive and corrosion-resistant. It does not require curing and achieves optimal thermal conductivity within seconds of application.
- Use: CPU/GPU
- Thermal conductivity: 12.8 W/(m·K)
- Density: 2.8 g/cm³
- Electrical conductivity: Non-conductive
- Corrosion resistance: Resistant
- Quantity: 4 g
- Quantity
- 4 gr
- Usage
- CPU/GPU
Important information
Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.