Description
Specifications
Rosfix XGSP50 paste combines Sn63 / Pb37 solder alloy powder with flux and is activated by heating to 183 °C. It is used for repairs and SMT, BGA and SMD work, as well as for pre-tinning BGA terminals with lead solder.
NC-559-ASM flux in a syringe has a gel consistency and is no-clean, so washing is not required after soldering. Its resin- and solvent-based formula makes application and even spreading easier, while any residue can be removed with isopropyl alcohol.
- Type: Solder paste
- Weight: 42 g
- Flux type: No-clean
- Alloy: Sn63 / Pb37
- Melting temperature: 183 °C
- Particle size: 25–38 µm
- Viscosity: 50 Pa·s
- Flux composition: Resin- and solvent-based
- Storage: 0–10 °C
- Applications: SMT, BGA, SMD and electronics repairs
Product Details
- Type
- Paste
Quantity
- Weight
- 42 gr
Important information
Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.