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Qoltec 51635 thermal paste is used between the processor and the base of the cooling system. It has high thermal conductivity and high electrical insulation, while filling gaps on contact surfaces and microscopic crevices. It is easy to apply and retains its properties for a long time without needing replacement.
Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.