The Xilence XZ028 thermal pad transfers heat from the processor to cooling systems. It has a thermal conductivity of 22.5 ± 0.1 W/m·K and a thermal resistance of less than 0.011 °C-in²/W.
It is applied between the processor and the cooling component, and its thermal impedance is 0.29 K/W.
- Type: Thermal pad
- Color: Gray
- Thickness: 0.25 mm
- Length: 38 mm
- Dimensions: 38 x 38 x 0.25 mm
- Thermal conductivity: 22.5 ± 0.1 W/m·K
- Thermal resistance: Less than 0.011 °C-in²/W
- Thermal impedance: 0.29 K/W
- Density: 2.6 g/cc
- Operating temperature: From -40 °C to 125 °C
- Storage temperature: From -50 °C to 250 °C
Main Specifications
- Type
- Thermal Pad
- Colour
- Grey
Thermal Pad Dimension
- Length
- 38 mm
- Width
- -
- Thickness
- 0.25 mm
Important information
Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.