AI-based PCB technology uses artificial intelligence algorithms to optimize vias, routing, and stackups. It ensures maximum performance and signal integrity at both the single-layer and multilayer levels throughout the entire design process.
-
AI-ViaFusion Technology
Optimized vias and pads for signal integrity
-
AI-Trace Technology
Smart routing for maximum performance
-
AI-Layer Technology
Custom stackups for improved functionality
Key features:
AI-generated design formulas, AI-driven simulation, AI-supported signal verification, signal optimization on single-layer and multilayer boards.
AI-ViaFusion™ Technology - Excellence in Signal Integrity with Artificial Intelligence
Reduce signal reflection by up to 28.2%.
AI-ViaFusion technology, an AI-assisted via optimization technology, determines the optimal via and pad sizes across all areas of printed circuit boards. This technology improves multilayer signal integrity and transmission performance, surpassing traditional design methods.
Best-in-class signal quality
- Superior signal transmission performance
- Significantly reduced signal reflection
- Improved signal quality and reliability
- Enhanced multilayer PCB signal performance
AI-ViaFusion Technology - AI Design Formula
AI-ViaFusion is a proprietary AI-generated hybrid through structural design. This PCB technology, validated through AI simulations and testing, aims to improve high-speed signal transmission.
-
Optimized via design
Varied via sizes for optimized signal and power paths
-
Pad-based optimization
Custom pad sizes for a balance of performance and manufacturability
-
Precise impedance matching
Via & pad sizes selected for optimal signal resistance
Unlock AI-supported performance with AI-ViaFusion technology
-
Minimized insertion loss
Optimized vias reduce signal loss
-
Increased return loss
Precise impedance matching reduces reflections
-
Optimized eye diagram
A wider eye opening improves signal integrity
AI-ViaFusion Technology - An AI-driven revolution in PCB design
Vias (Vertical Interconnect Access) are critical for multilayer PCB connectivity. Via size significantly affects signal integrity, influencing capacitance, reflections, and interference.
AI-ViaFusion technology optimizes PCB performance through:
-
Strategic via sizing
Optimized for diverse signals across the printed circuit board (PCB)
-
Improved impedance matching
Precise control through machine learning
-
Space optimization
Maximized layout efficiency with signal integrity
AI-Trace Technology
- Revolutionizing PCB routing with AI
AI-Trace technology transforms PCB design by leveraging Artificial Intelligence to optimize trace routing, resulting in improved performance and signal integrity.
-
Fiber weave mitigation
Optimized signal timing
-
Shielded memory routing
Optimized shielding and signal accuracy
-
Impedance-optimized topology
Refined traces with minimal resistance
-
Isolated memory routing
Optimized trace layout and layer separation
-
Daisy-chain routing
Innovative design eliminates signal bottlenecks
Experience next-generation PCB routing with GIGABYTE's AI-Trace technology.
Fiber weave mitigation with AI-Trace technology
The fiber weave effect in high-speed printed circuit boards comes from the varying dielectric constants of epoxy resin and glass fibers, which causes variable signal propagation speeds, leading to signal integrity issues such as crosstalk and jitter. AI-Trace technology applies innovative routing angles to mitigate this effect.
Mitigation benefits:
- Reduces signal distortion
- Improves transmission reliability
- Supports higher data rates
- Enhances overall system stability
AI-Layer Technology - Next-generation multilayer PCB design
AI-Layer technology creates innovative layer materials for multilayer printed circuit boards (PCBs), delivering unmatched performance.
Core Innovation:
Optimized Design with Custom AI Surfaces
- AI-optimized layer design
- Unique material for each layer
- AI-verified signal integrity
- Customized printed circuit board (PCB) for maximum performance
Key features:
AI-optimized PCB coating and design materialServer-grade low-loss PCB*Enhanced 2X copper technology
