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The advanced thermal paste with carbon nanoparticles sets new standards in cooling electronic devices. It features a thermal conductivity of 15.2 W/mK, effectively and quickly dissipating heat from processors, GPUs, and other high-temperature components.
Its innovative composition has been designed for demanding users:
It offers maximum stability and performance.
Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.