Flexible Thermal Pad Gelid suitable for applications where a material with high thermal conductivity is required. Ideal for:

• Connections with water block
• RAM modules
• Power supply components
• SMD components

The soft structure of the pad is suitable for irregularly shaped components and filling gaps from tiny scratches to noticeable uneven surfaces. The pad can be cut to the desired dimensions.

Thermal conductivity: 7W/mK

Dimensions: 120x20x0.5mm

Model: TP-GP03-A

Before use, remove the protective film from both sides.