The Gelid TP-GP03-A thermal pad transfers heat in applications such as liquid-cooling connections, RAM modules, power supply components, and SMD components. Its soft, flexible structure adapts to irregularly shaped components and fills gaps on surfaces with microscopic scratches or visible imperfections. It can be cut to the desired size.
Before use, remove the protective films from both sides.
- Thermal conductivity: 7 W/mK
- Dimensions: 120 x 20 x 0.5 mm
- Form: Flexible thermal pad
- Colour
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Important information
Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.