The Gelid thermal pad is suitable for applications that require flexible material with high thermal conductivity. It is used in water block connections with RAM modules, in power supply sections, and in SMD components. Its soft structure makes it ideal for cooling irregularly shaped elements.

• Dimensions: 120x20x1mm
• Thermal conductivity: 7W/mK
• Elongation resistance: 2Kgf/cm²
• Resistance: 1x10¹²Ω-cm
• Breakdown voltage: 10KV/mm
• Maximum elongation: 150%
• Hardness: 45 (Shore A)
• Specific weight: 3.15
• Operating temperature: -40 to 200 °C
• ROHS compliant
• Chlorine free
• Not electrically conductive