The new GIGABYTE B760 motherboards provide the most efficient solution to enjoy enhanced PCIe Gen5 performance on the existing platform. PCIe 5.0 doubles the data transfer rate of PCIe 4.0 from 16 GT/s to 32 GT/s per lane. This significant increase in bandwidth especially benefits high-performance graphics cards, storage devices, and AI accelerators that require faster data transfer.
Fully Covered Thermal Design
High-coverage MOSFET and integrated molded heatsinks for improved thermal performance with better airflow and heat dissipation.
4 Times Larger Surface Area
Increased surface area up to 4 times larger compared to traditional heatsinks. Improves heat dissipation from the MOSFETs.
True Single-Piece Construction
TMOS is a TRUE single-piece heatsink. Its single-piece design and larger surface area drastically improve cooling performance compared to the multi-piece design of competitors.
Multi-Cut Design
TMOS features multiple channels and inlets in the heatsink. This design allows airflow to pass through, resulting in significant improvement in heat transfer performance.
