Manhattan ICPU-GREASE20G

Thermal paste for CPU 20G

The thermal paste helps create maximum conductivity between the microprocessor and the CPU heatsink to reduce the risk of overheating. It is specially designed to reliably and easily cover manufacturing imperfections and fill critical gaps that can reduce cooling efficiency.

• Increases thermal conductivity between the CPU and the heatsink
• Assists in heat dissipation, extending the lifespan of the CPU
• Designed for multiple applications

Features:

• Color: Gray
• Thermal conductivity: >0.965 W/MK
• Thermal resistance: Specific gravity: >2.3
• Dielectric constant A: >5.1
• Thixotropic index: 380 ±10 1/10 mm
• Operating temperature: -30 – 180°C

Composition: Silicone compounds, 50%; Carbon compounds, 20%; Metal oxide compounds, 30%

Package contents: 1x Manhattan ICPU-GREASE20G - Thermal paste for CPU 20G