Solder alloy with flux produced from the primary melting of tin and lead according to the PN EN 29453:2000 standard. The process is continuous casting without exposure to air, followed by extrusion to eliminate oxides. The alloy has a thickness of 2.0 mm and a weight of 100 g, with tin content ranging from 59.5% to 60.5% and a melting temperature between 183°C and 190°C.

The flux SW26 is based on resin and an organic halogen activator, which after soldering is "bound" to the resin, preventing direct contact with the soldering substance and preventing corrosion, while facilitating melting and increasing the fluidity of the solder.

The solder alloy is mainly used in the electronics industry for the production of standardized devices and electronic components, as well as in electrotechnics.